HEF-8002
Toughness epoxy resin
Characteristic
Ø Improve K1c over 2 times;
Ø Excellent toughness and low shrinking;
Ø Accelerate curing speed and lower reaction temperature;
Ø Improve Tg and heat resistance;
Ø Improve chemical and water resistance;
Ø Low total chlorine <1500ppm;
Ø Improve adhesion(glass, metal, plastic, rubber, glass / carbon fiber etc.);
Ø Very good compatibility with other kind of epoxy resin ;
Ø Suitable for many kinds of curing system;
Application:
Ø LED encapsulation; |
Ø Epoxy adhesive; |
Ø Power, electrical casting; |
Ø PCB ink, solder mask; |
Ø Epoxy casting, putting; |
Ø 3D resin system; |
Ø Glass/Carbon fiber reinforcement |
Technical data:
Appearance |
Colorless or light yellow liquid |
Color (Gardner) |
<2 |
Viscosity (cps@25℃) |
30000-50000 |
EEW |
200-210 |
T-Cl(ppm) |
<1500 |